Xiaomi Unveils Xring Chip, Teams With TSMC for 3nm Production
Xiaomi has unveiled its second-generation in-house smartphone processor, the Xring O3, with TSMC set to manufacture it using 3-nanometre technology, according to sources. The chip is expected to power an upcoming flagship folding phone with shipment targets of 200,000 to 300,000 units, as Xiaomi deepens its push into proprietary silicon.