Supernodes: China’s AI Chipmakers Shift Focus to System-Level Scaling
As artificial intelligence models expand beyond 1 trillion parameters, a new concept is dominating the computing landscape: the "supernode." At this year's World Artificial Intelligence Conference (WAIC) in Shanghai, Chinese chipmakers from Huawei to Biren Technology showcased new hardware designed to knit hundreds or thousands of chips together to act as one giant supercomputer, according to a report by the South China Morning Post (SCMP).
The focus on supernodes at WAIC reflects a shift in competition across China's AI computing ecosystem, the SCMP reported, citing Morgan Stanley analysts. The analysts said the emphasis is moving away from stand-alone chip specifications and towards "interconnects, memory sharing, and system reliability."
Chen Daliang, CEO of Shanghai-based AI computing resources provider Suanova, a subsidiary of Hong Kong-listed Yeebo Technology, was quoted by the SCMP as saying that "people think putting enough GPUs together makes a supernode, which is definitely not the case."
Biren Technology, a Shanghai-based semiconductor design firm, used the conference to unveil its next-generation "supernode" solutions. According to a separate SCMP report, these systems are designed to link thousands of AI chips across a single cluster by using optical data transmission to bypass current hardware limits.
Ding Yunfan, vice-president of AI framework architecture at Biren, said single-GPU performance was no longer sufficient to handle required workloads. The core challenge, he stressed, was transforming massive GPU clusters into integrated, seamless systems.
Speaking at WAIC on Friday, Ding noted that traditional copper-wired electrical connections were hitting a physical wall, effectively restricting current architectures to 128 GPUs per server. To break through that ceiling, Biren is betting on a distributed, decoupled supernode architecture and near-packaged optics (NPO), which integrates optical fibres closer to chips to boost data speeds. The layout could allow Biren to scale up to 1,024 cards across a cluster.
"Optical interconnect has become an inevitable choice to break through this bottleneck," Ding said.
The launch underscores how highly connected server systems have become one of the latest battlegrounds for AI infrastructure companies, the SCMP report noted. The industry is currently racing to scale up raw computing power as AI models advance to trillions of parameters and AI agent applications gain widespread adoption.
Biren is only the latest domestic player to announce progress in addressing infrastructure limitations, the SCMP added.