Lead

Nvidia Corp. Chief Executive Jensen Huang met with SK Group Chairman Chey Tae-won in Taipei on Monday to discuss future cooperation in artificial intelligence (AI) memory, SK Group said on Tuesday. The meeting took place on the sidelines of Computex, one of Asia's largest technology trade shows, where both executives were attending, according to a post on SK Group's Facebook account.

"With SK hynix reaching a market capitalization of US$1 trillion, the executives of both companies met to share the significance of the milestone," the post said. It added that the gathering also provided an opportunity to reflect on the achievements the two companies have made together in AI memory and reaffirm their commitment to opening a new chapter in AI infrastructure.

Coverage Comparison

The meeting was reported by Yonhap News, which provided details on the executives' interactions, company announcements, and production plans. Yonhap noted that Huang visited SK hynix's booth later in the day to review key memory products, including next-generation high-bandwidth memory (HBM) and advanced module solutions. During the visit, he left handwritten notes on display wafers, writing "Please make more" on an HBM4E sample and "Love SOCAMM" on a SOCAMM module.

Yonhap also reported that SK hynix supplies Nvidia with HBM4, its latest HBM, as well as high-performance and low-power memory, such as LPDDR5X. Additionally, a day before the meeting, Huang confirmed that Nvidia has begun mass production of Vera Rubin, its next-generation AI computing platform designed for large-scale data center workloads, which is equipped with HBM4.

Key Claims

  • Leadership Meeting: Jensen Huang, CEO of Nvidia, met with SK Group Chairman Chey Tae-won in Taipei to discuss cooperation in AI memory, as reported by Yonhap, citing SK Group's Facebook post.
  • Market Milestone: SK hynix has reached a market capitalization of US$1 trillion, a milestone that the two executives met to acknowledge, according to SK Group's post.
  • Production Plans: Chey Tae-won announced that SK hynix plans to double its wafer production capacity over the next five years. He made the remarks to reporters at Computex, noting that the memory bottleneck is likely to continue until 2030. "It requires not only a lot of investments, but at least three years to build a new memory fab," Chey said. "Despite such challenges, we plan to double our production capacity of wafers over the next five years." This is reportedly the first time Chey has made public SK hynix's future production plans.
  • Trilateral Partnership: Chey mentioned the trilateral partnership between SK hynix, Nvidia, and TSMC Ltd., calling it "greater than ever." He said, "We are working together in base die of HBM4 chips with TSMC, it's the best partnership ever."
  • Nvidia's Next-Gen Platform: Huang confirmed that Nvidia has begun mass production of Vera Rubin, its next-generation AI computing platform equipped with HBM4.
  • Expected Seoul Visit: Yonhap reported that Huang is expected to visit Seoul and meet with heads of major South Korean conglomerates, as well as visit Seoul National University to meet AI researchers.
  • Production Investments: SK hynix is rolling out major investments in its production facilities, including its first advanced packaging factory under construction in the United States, according to Yonhap.

Perspectives

SK Group Chairman Chey Tae-won expressed optimism about the company's growth and partnerships. He stated that SK hynix's production capacity expansion plans are underway despite investment challenges, and he emphasized the strength of the collaboration with Nvidia and TSMC. His comments highlight a forward-looking approach to meeting AI memory demand.